劉德騏特聘教授

學歷

密蘇里大學蘿拉分校 / 美國 / 機械工程系 / 博士

專長

電子構裝、衝擊力學、電腦輔助工程設計、計算力學

分機

33305

E-mail

imedsl@ccu.edu.tw

辦公室

系館425

實驗室

工廠202 光機電結構分析實驗室 | 分機：23347

期刊論文

001 1989 R. C. Batra and D. S. Liu, “Adiabatic Shear Bands in Plane StrainProblems", ASME Journal of Applied Mechanics,” Vol. 56, pp. 527-534, 1989. 【SCI , EI】

002 1990 R. C. Batra and D. S. Liu, “Adiabatic Shear Bands in Dynamic PlaneStrain Compression of a Viscoplastic Material,” InternationalJournal of Plasticity, Vol. 6, pp. 231-246, 1990. 【SCI ,EI】

003 1991 D. S. Liu, “Vehicle Rear Barrier Impact Simulation by UsingNonlinear Finite Element Approach,” American Society of Mechanical Engineers, Applied Mechanics Division, AMD, v 126,Crashworthiness and Occupant Protection in Transportation Systems - 1991, PP. 207-215, 1991. 【EI】

004 1995 D. S. Liu, Jason Chien, Yu-Chung Hsieh, Ming-Li Chen “Crashworthness Design of the Vehicle Interior by Using Brain Pressure Tolerance and Explicit Finite Element Approach,” American Society of Mechanical Engineers, Applied Mechanics Division,AMD, v 210, Crashworthhiness and Occupant Protection in Transportation Systems, 1995, PP. 383-394, 1995. 【EI】

005 1995 D. S. Liu and M. Lee, “Analysis of Adiabatic Shear Bands in Thermo-visco plastic Malerials Under Combined Loading",Constitutive Laws: Theory, Experiments and Numerical Implementaton,” A Series Handbooks on Theory and Engineering Applications of Computational Methods, PP. 246-251, 1995.

006 1998 D. S. Liu, Jason Chien, Yu-Chung Hsieh, Ming-Li Chen “Design Depowered Airbag Mass Flow Rate by Using Occupant Simulation Models and Neural Network,” American Society of Mechanical Engineers, Applied Mechanics Division, AMD, v 230,Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, PP. 141-148, 1998. 【EI】

007 1998 D. S. Liu, T. C. Lee “A Solid-Fluid Coupling Computing Method for Design High Speed Spindle Cooling System,” American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP, v 381, Recent Advances in Solids and Structures,PP. 215-222, 1998. 【EI】

008 1998 D. S. Liu, S. C. Hsu, and Y. C. Tung “Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moire’ and Finite Element Method,” American Society of Mechanical Engineers, EEP, v 24,Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, PP. 51-58, 1998. 【EI】

009 2002 D. S. Liu and C. Y. Ni, "A Thermo-mechanical Study on the electrical Resistance of Aluminum Wire Conductors”,Microelectronics Reliability ,Vol. 42, No. 3, PP. 367-374, 2002.【SCI ,EI】

010 2002 D. S. Liu and C. Y. Ni, "Using New Strategy to Optimize The Bump Design Parameters in Flip Chip (FC) Packages”, Engineering Optimization,Vol. 34, No. 4, PP. 355-367, 2002. 【SCI ,EI】

011 2002 D. S. Liu and C. Y. Ni, “A Study on the electrical Resistance of Solder Joint Interconnections,” Microelectronics Engineering, Vol.63, Issue 4, PP. 363-372, 2002.【SCI ,EI】

012 2002 D. S. Liu and C. Y. Ni, T. C. Tsay, and C. Y. Kao "Thermal Stress Analysis and Design Optimization of Direct Chip Attach (DCA) and Chip Scale Packaging (CSP) in Flip Chip Technology”, Engineering Optimization, Vol. 34, No. 6, PP. 591-611, 2002. 【SCI ,EI】

013 2002 D. S. Liu, and C. Y. Ni, “ The optimization design of bump interconnections in flip chip packages from the electrical standpoint,”Microelectronics Reliability , Vol. 42, Issue 12, PP. 1893-1901, 2002.【SCI ,EI】

014 2002 C. Y. Ni, D. S. Liu, and C. Y. Chen, " Procedure for design optimization of a T-cap flip chip package”, Microelectronics Reliability , Vol. 42, Issue 12, PP. 1903-1911, 2002. 【SCI ,EI】

015 2002 D. S. Liu, Y. S. Shih, C. Y. Ni, D. Y. Chiou, C. L. Chung and M. L. Huang " Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength”, Experimental Techniques, Vol.26, No. 6, PP. 29-36, 2002. 【SCI ,EI】

016 2003 D. S. Liu, and Y. C. Chao,“ Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire,” Journal of Electronic Materials, Vol. 32, No. 3, PP.159-165, March, 2003. 【SCI ,EI】【NSC-89-2212-E-194-017】

017 2003 D. S. Liu, C. Y. Ni, and C. Y. Chen "Integrated Design Method of for Flip Chip CSP with Electrical, Thermal and Thermo-mechanical Qualifications”, Finite Element in Analysis and Design Vol. 39,Issue 7, PP. 661-677, April, 2003. 【SCI ,EI】【NSC-88-2212-E-194-010】

018 2003 D. S. Liu, and D. Y. Chiou,“ A Coupled IEM/FEM approach for Solving The Elastic Problems with Multiple Cracks,” International Journal of Solids and Structures, Vol. 40, Issue 8, PP. 1973-1993, April 2003. 【SCI ,EI】【NSC88-2212-E-194-010】

019 2003 D. S. Liu, and D. Y. Chiou,“3-D IEM formulation and a coupling IEM/FEM scheme for solving elastostatic problems,” Advances in Engineering Software, Vol. 34, Issue 6, PP. 309-320, June 2003.【SCI ,EI】【NSC90-2212-E-194-032】

020 2003 D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen and H. S. Liu, "Numerical Study on the Bonding Tool Position, Tip Profile and Planarity Angle Influences on TAB/ILB Interconnection Reliability”,Microelectronics Reliability , Vol. 43, Issue 43, PP. 935-943, 2003.【SCI ,EI】【NSC-91-2212-E-194-012】

021 2003 D. S. Liu, Chia-Yuan Chang, Chin-Ming Fan and Shu-Lin Hsu, "Influence of environmental factors on energy absorption degradation of polystyrene foam in protective helmets”, Engineering Failure Analysis, Vol. 10, Issue 5, PP. 581-591, October 2003. 【SCI ,EI】【NSC- 90-2213-E-194-027】

022 2003 L. T. Chang, G. L. Chang, J. Z. Huang, S. C. Huang, D. S. Liu and C. H. Chang,“Finite Element Analysis of the Effect of Motorcycle Helmet Materials Against Impact Velocity”, Journal of the Chinese Institute of Engineers, Vol. 26, No. 6, PP. 835-843, 2003.【SCI ,EI】

023 2003 Y. C. Chao, D. S. Liu, “Gold Wire and Solder Joint Microforce Testing Using Microforce Tester”, Experimental Techniques, Vol.27, No. 5, 2003. 【SCI ,EI】

024 2004 D. S. Liu, Y. C. Chao, and C. H. Wang “ Study of Wire Bonding Looping Formation in the Electronic Packaging Process Using the Three Dimensional Finite Element Method,” Finite Element in Analysis and Design, Vol. 40, Issue 3, PP. 263-286, January, 2004.【SCI ,EI】

025 2004 D. S. Liu, D. Y. Chiou, and C. H. Lin,“A Hybrid 3D Thermo-elastic Infinite Element Modeling for Area-Arrey Package Solder Joints,”Finite Element in Analysis and Design, Vol. 40, Issue 3, PP. 1703-1727, August, 2004. 【SCI ,EI】【NSC90-2212-E-194-032】

026 2004 D. S. Liu, and D. Y. Chiou,“Modeling of Inclusions with Interphase in Heterogeneous Material Using the Infinite Element Method,”Computational Materials Science, Vol. 31, Issue 3-4, PP. 405-420,November 2004. 【SCI ,EI】【NSC90-2212-E-194-032】

027 2004 De-Shin Liu, Nan-Chun Lin, Chao-Chin Huang, and Yin-Lee Meng “Structural design optimization of side/rear impact guards using a coupled Genetic Algorithm finite 97, 2004. 【EI】【NSC90-2212-E-194-032】

028 2005 D. S. Liu, and D. Y. Chiou,“ Geometric Singularity Problem Modeling and Formulation with an Unbounded Domain Using the Infinite Element Method,” Computers and Structures, Vol. 83, Issue 25-26, PP. 2086-2099, September, 2005. 【SCI ,EI】【NSC 93-2218-E-194-006】

029 2005 D. S. Liu, C. Y. Chen and D. Y. Chiou,“3-D Modeling of a composite material reinforced with multiple thickly coated particles using the infinite element method,” CMES-Computer Modeling in Engineering & Science, Vol. 9, No.2, PP. 179-191 , August, 2005.【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

030 2006 D. S. Liu, C. Y. Chen, and Y. C. Chao,“A Thermo-mechanical Study on Electrical Resistance of Cu Lead Interconnection,” Journal of Electronic Materials, Vol. 35, No. 5, PP. 958-965, May, 2006.【SCI ,EI】

031 2006 D. S. Liu, and M. K. Shih,“An experimental and numerical investigation into multilayer probe card layout design,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29,No. 3, PP. 163-170, July, 2006.【SCI ,EI】

032 2006 C. Y. Chen, Y. C. Chao, D. S. Liu, and Zhen-Wei Zhuang,“Design of a Novel Chip on Glass Packaging Solution for CMOS Image Sensor Device,” Microelectronics Reliability, Vol. 46, Issue 8, PP. 1326-1334 , August, 2006. 【SCI ,EI】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

033 2006 D. S. Liu, and M. K. Shih,“Experimental Method and FE Simulation Model for Evaluation Wafer Probing Parameters,” Microelectronics Journal, Vol. 37, Issue 9, PP. 871-883, September, 2006.【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

034 2006 Shaw-Ruey Lyu, Jeh-En Tzeng, Chia-Yuan Chang, Ai-Ru Jian, and De-Shin Liu,“Mechanical Strength of Mediopatellar Plica - the Influence of Its Fiber Content,” Clinical Biomechanics, Vol. 21,Issue 8, PP. 860-863, October, 2006. 【SCI ,EI】【NSC-93-2213-E-194-006】

035 2006 D. S. Liu, M. K. Shih, S. M. Liu, Tony Huang, Y. C. Chao, and C. C.Yu, “Experimental Aided Performance Evaluation Methods for Wafer Probe Test”, Experimental Techniques, Vol. 30, Issue 5, PP. 23-27,September/October, 2006. 【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

035 2007 D. S. Liu, M. K. Shih, and W. H. Huang,“Measurement and Analysis of Wafer Probe Testing Contact Resistance,” Microelectronics Reliability, Vol. 47, PP. 1086-1094 , 2007. 【SCI ,EI】

037 2007 C. Y. Ni, C. M. Chang, D. S. Liu, H. Y. Pan, and T. D. Yang,“Thermal Characterization of Thermal Interface Materials”, Experimental Techniques, Published article online: 4-May-2007,2007. 【SCI ,EI】

038 2007 D. S. Liu, and M. K. Shih,“An investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multi-probing Process,” IEEE Transactions on Components and Packaging Technologies, Submitted, June20, 2006, Revised,March04, Revised/re-submit, June 30, Accepted, July 21, 2007.【SCI ,EI】

039 2007 C. Y. Ni, C. M. Chang, D. S. Liu, H. Y. Pan, and T. D. Yang,“Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability”, Journal of Microelectronics and Electronic Packaging, Accepted, Oct. 05,2007. 【EI】

040 2007 T. N. Shiau, C. H. Kang, and D. S. Liu,“Interval optimization of rotor-bearing systems with dynamic behavior constraints using an interval-genetic algorithm,” Structural and Multidisciplinary Optimization, Revised, March. 11, 2rd Revised, July 15 , Accepted,Oct. 09,2007. 【SCI ,EI】

041 2007 Ching-I Chen, Ching-Yu Ni, H. Y. Pan, C. M. Chang, S. S. Yeh, and De-Shin Liu,“Practical evaluation for long-term stability of thermal interface Material,” Experimental Techniques, Submitted, April 02, accepted, Nov. 21, 2007. 【SCI ,EI】

042 2007 D. S. Liu, S. S. Yeh ,C. T. Kao, H. C. Shen, G. S. Shen, and H. H. Liu,“Optimization of bonding force, sinking value and potting gap size in COF inner lead bonding process,” IEEE Transactions on Advanced Packaging, Submitted, February 14, Reviced Nov. 05,2007. 【SCI ,EI】

研討會論文

1.C. O. Chang, C. S. Chou, F. H. Shieh, and G. E. Chang, Vibration analysis of single-crystal silicon micro-ring gyroscopes, Proceeding of the 2006 Cross-Strait Workshop on Engineering Mechanics, Taipei, Taiwan, Sep. 29-Oct. 5 (2006).
2.C. O. Chang, G. E. Chang, C. S. Chou and F. H. Shieh, Single-crystal silicon micro-ring gyroscopes-attitude sensors, Proceeding of 3rd International Conference on Recent Advances in Space Technologies, Istanbul, Turkey, June 14-16 (2007).
3.C. O. Chang, G. E. Chang, C. S. Chou and F. H. Shieh, Single-crystal silicon micro-ring gyroscopes, Proceeding of the 12th Asia Pacific Vibration Conference, Sapporo, Japan, Aug. 6-9 (2007).
4.G. E. Chang, C. O. Chang, C. S. Chou, and W. T. C. Chien, Silicon micro-ring gyroscopes, Proceeding of the 2007 ASME International Mechanical Engineering Congress & Exposition, Seattle, USA, Nov. 11-15 (2007).
5.G. E. Chang, C. S. Chou, W. T. C. Chien, P. C. Chen, F. H. Shieh, and C. O. Chang, Analysis and fabrication of anisotropic Si(100) micro-ring gyroscopes, Proceeding of the International Workshop on Solid-State Gyroscope, Yalta, Ukraine, May 18-20 (2009).
6.G. E. Chang and C. O. Chang, Design of strain-free GeSn/SiGeSn quantum-well electroabsorption modulators at 1550 nm wavelength, 7th International Conference on Group IV Photonics, Beijing, China, Sep. 1-3 (2010).
7.Yun-Hao Hsieh, Wen-Yao Hsieh, Hsuan-Han Tseng, Yu-Kai Liu, H H Cheng, and Guo-En Chang*, Enhanced infrared optical absorption in GeSn alloys for Si-based photodetectors with full telecom-bands photodetection, 2012 International Photonics and OptoElectronics Meetings, Wuhan, China, Nov. 1-2 (2012).
8.林文鴻，張國恩 * "矽基鍺錫自聚式量子點力學特性之有限元素分析," 中華民國力學學會第三十六屆全國力學會議, 中壢, 台灣, Nov. 16-17 (2012).

研發專利

001 2000 鄭友仁，林呈彰，劉德騏， “高速滾動軸承潤滑噴嘴裝置,”美國專利第6,158,898 號（核準日期：12/12/2000）。

002 2001 鄭友仁，林呈彰，劉德騏， “高速滾動軸承潤滑噴嘴裝置,” 中華民國新型專利第151678 號（核準日期：05/09/2001）, 日本專利申請中, 德國專利申請中。

003 2002 劉德騏， “主軸結構熱傳分析軟體與技術,” 專利技術移轉，臺灣麗偉電腦機械股份有限公司，2002.

004 2007 劉德騏， “可調整潰縮能量之方向機柱,” 專利申請中，申請案號96103203.

005 2007 劉德騏， “內藏式漸增潰縮能量之方向機柱,” 專利申請中，申請案號96103888.

執行計畫

研究計畫：

計畫名稱	工作	起訖年月	委託機構
車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術	主持人	94.12.1~95.11.30	大葉大學(經濟部分包/學界科專計畫)
車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術	主持人	94.12~95.3	大葉大學(經濟部分包/學界科專計畫)
空氣囊設計原理與測試方法技術建立	主持人	94.3.15~94.7.15	全興創新科技股份有限
散熱膠熱阻係數量測實驗與分析研究計劃	主持人	94.7.1~94.12.31	台積電
OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(1/3)	主持人	94.8.1~2006.7.31	國科會
奈米壓印技術應用於製作金屬次微米結構之研究-子計畫三：奈米壓印材料機械性質與成形數值分析方法之研究(2 /3)	主持人	94.8.1~95.7.31	國科會
車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術(第二年度)	主持人	95.12.1~96.11.30	大葉大學(經濟部分包/學界科專計畫)
TFT-LCD八代自動倉儲系統台車之舉匝機構強度、動態模擬分析技術研究	主持人	95.5.1~96.7.31	高僑自動化科技股份有限公司
TFT-LCD八代自動倉儲系統台車之舉匝機構強度、動態模擬分析技術研究	共同主持人	95.5~96~7	高僑自動化科技股份有限公司
散熱膠接觸熱阻係數量測實驗與分析研究計劃(II)	主持人	95.7.1~95.12.31	台積電
探針卡可靠度實測與分析	主持人	95.7.1~96.6.30	南茂科技股份有限公司
散熱膠接觸熱阻係數量測實驗與分析研究計劃(II)	主持人	95.7~95.12	台積電
奈米壓印技術應用於製作金屬次微米結構之研究-子計畫三：奈米壓印材料機械性質與成形數值分析方法之研究(3/3)	主持人	95.8.1~96.7.31	國科會整合型
OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(2/3)	主持人	95.8.1~96.7.31	國科會
無鉛銲錫接點微衝擊實驗測試與損傷模式分析	主持人	96.1.1~96.12.31	南茂科技股份有限公司
晶粒捲帶式封裝(COF)銲合參數與電路板翹曲分析之研究	主持人	96.1.1~96.12.31	南茂科技股份有限公司
探針卡可靠度實測與分析	主持人	96.1.1~97.5.31	南茂科技股份有限公司
車輛結構與乘員安全系統暨車輛結構次系統抗撞設計研發技術(第三年度)	主持人	96.12.1~97.11.30	大葉大學(經濟部分包/學界科專計畫)
側撞安全防護系統分析研究	主持人	96.12.1~97.11.30	全興創新科技股份有限公司
運動鞋之有限元素模型建立與靜/動態模擬分析	主持人	96.5.1~97.4.30	寶元科技股份有限公司
車輛結構對行人安全分析模型之研究	主持人	96.7.1~97.2.28	國科會
智慧型空氣氣囊系統參數分析研究	主持人	96.7.1~96.11.30	全興創新科技股份有限公司
OELD封裝製程UV封合固化參數對膠膜的黏合性與可靠度之研究(3/3)	主持人	96.8.1~97.7.31	國科會
無鉛銲錫接點微衝擊實驗分析(2)	主持人	97.1.1~97.12.31	南茂科技股份有限公司
覆晶軟板式COF/ILB銲接參數與GOF封裝元件熱傳導分析與研究	主持人	97.1.1~97.12.31	南茂科技股份有限公司
封裝銲錫點高速衝擊實測與分析	主持人	97.1.1~98.12.30	精材科技股份有限公司
微力彎矩實測試與分析技術服務	主持人	97.10.1~98.6.30	臺灣機體電路製造股份有限公司
運動鞋之有限元素分析方法建立與脫膠模擬分析	主持人	97.5.1~98.4.30	寶元科技股份有限公司
探針卡可靠度實測與分析	主持人	97.7.1~97.6.30	南茂科技股份有限公司
牙齒舌側矯正元件製造分析與齒型變形模擬	主持人	97.8.1~98.7.31	國科會
熱軋製程鋼胚微觀組織演化預測研究	主持人	97.8.1~98.7.31	中鋼
科學工業區固本精進研究計畫-先進超薄晶園之針測技術研發	主持人	98.5.1~99.4.30	國科會
運動鞋之脫膠模擬鑄造之熱翹曲分析	主持人	98.5~99.4	寶元科技股份有限公司
覆晶軟板式COF短邊凸塊配置設計之應力分析與散熱貼片與FCOF封裝體之熱傳導分析之研究	主持人	98.1.1.~98.12.31	南茂科技股份有限公司
手動輪倚結構參數優化分析	主持人	98.4.1.~98.6.30	財團法人自行車暨健康科技工業研究發展中心
由慢性疾病微創手術之科技創新探討高齡化社會之全面健康照護策略模式：以退化性膝關節炎為例	主持人	98.6.1~99.5.31	行政院國家科學技術發
電子封裝無鉛銲錫接點之高速剪向衝擊實驗發展與抗撞分析之研究	主持人	98.8.1~99.7.31	國科會

瀏覽數:

友善列印

劉德騏 特聘教授

劉德騏特聘教授