密蘇里大學蘿拉分校 / 美國 / 機械工程系 / 博士

001 1989 R. C. Batra and D. S. Liu, “Adiabatic Shear Bands in Plane StrainProblems", ASME Journal of Applied Mechanics,” Vol. 56, pp. 527-534, 1989. 【SCI , EI】

002 1990 R. C. Batra and D. S. Liu, “Adiabatic Shear Bands in Dynamic PlaneStrain Compression of a Viscoplastic Material,” InternationalJournal of Plasticity, Vol. 6, pp. 231-246, 1990. 【SCI ,EI】

003 1991 D. S. Liu, “Vehicle Rear Barrier Impact Simulation by UsingNonlinear Finite Element Approach,” American Society of Mechanical Engineers, Applied Mechanics Division, AMD, v 126,Crashworthiness and Occupant Protection in Transportation Systems - 1991, PP. 207-215, 1991. 【EI】

004 1995 D. S. Liu, Jason Chien, Yu-Chung Hsieh, Ming-Li Chen “Crashworthness Design of the Vehicle Interior by Using Brain Pressure Tolerance and Explicit Finite Element Approach,” American Society of Mechanical Engineers, Applied Mechanics Division,AMD, v 210, Crashworthhiness and Occupant Protection in Transportation Systems, 1995, PP. 383-394, 1995. 【EI】

005 1995 D. S. Liu and M. Lee, “Analysis of Adiabatic Shear Bands in Thermo-visco plastic Malerials Under Combined Loading",Constitutive Laws: Theory, Experiments and Numerical Implementaton,” A Series Handbooks on Theory and Engineering Applications of Computational Methods, PP. 246-251, 1995.

006 1998 D. S. Liu, Jason Chien, Yu-Chung Hsieh, Ming-Li Chen “Design Depowered Airbag Mass Flow Rate by Using Occupant Simulation Models and Neural Network,” American Society of Mechanical Engineers, Applied Mechanics Division, AMD, v 230,Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, PP. 141-148, 1998. 【EI】

007 1998 D. S. Liu, T. C. Lee “A Solid-Fluid Coupling Computing Method for Design High Speed Spindle Cooling System,” American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP, v 381, Recent Advances in Solids and Structures,PP. 215-222, 1998. 【EI】

008 1998 D. S. Liu, S. C. Hsu, and Y. C. Tung “Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moire’ and Finite Element Method,” American Society of Mechanical Engineers, EEP, v 24,Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, PP. 51-58, 1998. 【EI】

009 2002 D. S. Liu and C. Y. Ni, "A Thermo-mechanical Study on the electrical Resistance of Aluminum Wire Conductors”,Microelectronics Reliability ,Vol. 42, No. 3, PP. 367-374, 2002.【SCI ,EI】

010 2002 D. S. Liu and C. Y. Ni, "Using New Strategy to Optimize The Bump Design Parameters in Flip Chip (FC) Packages”, Engineering Optimization,Vol. 34, No. 4, PP. 355-367, 2002. 【SCI ,EI】

011 2002 D. S. Liu and C. Y. Ni, “A Study on the electrical Resistance of Solder Joint Interconnections,” Microelectronics Engineering, Vol.63, Issue 4, PP. 363-372, 2002.【SCI ,EI】

012 2002 D. S. Liu and C. Y. Ni, T. C. Tsay, and C. Y. Kao "Thermal Stress Analysis and Design Optimization of Direct Chip Attach (DCA) and Chip Scale Packaging (CSP) in Flip Chip Technology”, Engineering Optimization, Vol. 34, No. 6, PP. 591-611, 2002. 【SCI ,EI】

013 2002 D. S. Liu, and C. Y. Ni, “ The optimization design of bump interconnections in flip chip packages from the electrical standpoint,”Microelectronics Reliability , Vol. 42, Issue 12, PP. 1893-1901, 2002.【SCI ,EI】

014 2002 C. Y. Ni, D. S. Liu, and C. Y. Chen, " Procedure for design optimization of a T-cap flip chip package”, Microelectronics Reliability , Vol. 42, Issue 12, PP. 1903-1911, 2002. 【SCI ,EI】

015 2002 D. S. Liu, Y. S. Shih, C. Y. Ni, D. Y. Chiou, C. L. Chung and M. L. Huang " Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength”, Experimental Techniques, Vol.26, No. 6, PP. 29-36, 2002. 【SCI ,EI】

016 2003 D. S. Liu, and Y. C. Chao,“ Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire,” Journal of Electronic Materials, Vol. 32, No. 3, PP.159-165, March, 2003. 【SCI ,EI】【NSC-89-2212-E-194-017】

017 2003 D. S. Liu, C. Y. Ni, and C. Y. Chen "Integrated Design Method of for Flip Chip CSP with Electrical, Thermal and Thermo-mechanical Qualifications”, Finite Element in Analysis and Design Vol. 39,Issue 7, PP. 661-677, April, 2003. 【SCI ,EI】【NSC-88-2212-E-194-010】

018 2003 D. S. Liu, and D. Y. Chiou,“ A Coupled IEM/FEM approach for Solving The Elastic Problems with Multiple Cracks,” International Journal of Solids and Structures, Vol. 40, Issue 8, PP. 1973-1993, April 2003. 【SCI ,EI】【NSC88-2212-E-194-010】

019 2003 D. S. Liu, and D. Y. Chiou,“3-D IEM formulation and a coupling IEM/FEM scheme for solving elastostatic problems,” Advances in Engineering Software, Vol. 34, Issue 6, PP. 309-320, June 2003.【SCI ,EI】【NSC90-2212-E-194-032】

020 2003 D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen and H. S. Liu, "Numerical Study on the Bonding Tool Position, Tip Profile and Planarity Angle Influences on TAB/ILB Interconnection Reliability”,Microelectronics Reliability , Vol. 43, Issue 43, PP. 935-943, 2003.【SCI ,EI】【NSC-91-2212-E-194-012】

021 2003 D. S. Liu, Chia-Yuan Chang, Chin-Ming Fan and Shu-Lin Hsu, "Influence of environmental factors on energy absorption degradation of polystyrene foam in protective helmets”, Engineering Failure Analysis, Vol. 10, Issue 5, PP. 581-591, October 2003. 【SCI ,EI】【NSC- 90-2213-E-194-027】

022 2003 L. T. Chang, G. L. Chang, J. Z. Huang, S. C. Huang, D. S. Liu and C. H. Chang,“Finite Element Analysis of the Effect of Motorcycle Helmet Materials Against Impact Velocity”, Journal of the Chinese Institute of Engineers, Vol. 26, No. 6, PP. 835-843, 2003.【SCI ,EI】

023 2003 Y. C. Chao, D. S. Liu, “Gold Wire and Solder Joint Microforce Testing Using Microforce Tester”, Experimental Techniques, Vol.27, No. 5, 2003. 【SCI ,EI】

024 2004 D. S. Liu, Y. C. Chao, and C. H. Wang “ Study of Wire Bonding Looping Formation in the Electronic Packaging Process Using the Three Dimensional Finite Element Method,” Finite Element in Analysis and Design, Vol. 40, Issue 3, PP. 263-286, January, 2004.【SCI ,EI】

025 2004 D. S. Liu, D. Y. Chiou, and C. H. Lin,“A Hybrid 3D Thermo-elastic Infinite Element Modeling for Area-Arrey Package Solder Joints,”Finite Element in Analysis and Design, Vol. 40, Issue 3, PP. 1703-1727, August, 2004. 【SCI ,EI】【NSC90-2212-E-194-032】

026 2004 D. S. Liu, and D. Y. Chiou,“Modeling of Inclusions with Interphase in Heterogeneous Material Using the Infinite Element Method,”Computational Materials Science, Vol. 31, Issue 3-4, PP. 405-420,November 2004. 【SCI ,EI】【NSC90-2212-E-194-032】

027 2004 De-Shin Liu, Nan-Chun Lin, Chao-Chin Huang, and Yin-Lee Meng “Structural design optimization of side/rear impact guards using a coupled Genetic Algorithm finite 97, 2004. 【EI】【NSC90-2212-E-194-032】

028 2005 D. S. Liu, and D. Y. Chiou,“ Geometric Singularity Problem Modeling and Formulation with an Unbounded Domain Using the Infinite Element Method,” Computers and Structures, Vol. 83, Issue 25-26, PP. 2086-2099, September, 2005. 【SCI ,EI】【NSC 93-2218-E-194-006】

029 2005 D. S. Liu, C. Y. Chen and D. Y. Chiou,“3-D Modeling of a composite material reinforced with multiple thickly coated particles using the infinite element method,” CMES-Computer Modeling in Engineering & Science, Vol. 9, No.2, PP. 179-191 , August, 2005.【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

030 2006 D. S. Liu, C. Y. Chen, and Y. C. Chao,“A Thermo-mechanical Study on Electrical Resistance of Cu Lead Interconnection,” Journal of Electronic Materials, Vol. 35, No. 5, PP. 958-965, May, 2006.【SCI ,EI】

031 2006 D. S. Liu, and M. K. Shih,“An experimental and numerical investigation into multilayer probe card layout design,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29,No. 3, PP. 163-170, July, 2006.【SCI ,EI】

032 2006 C. Y. Chen, Y. C. Chao, D. S. Liu, and Zhen-Wei Zhuang,“Design of a Novel Chip on Glass Packaging Solution for CMOS Image Sensor Device,” Microelectronics Reliability, Vol. 46, Issue 8, PP. 1326-1334 , August, 2006. 【SCI ,EI】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

033 2006 D. S. Liu, and M. K. Shih,“Experimental Method and FE Simulation Model for Evaluation Wafer Probing Parameters,” Microelectronics Journal, Vol. 37, Issue 9, PP. 871-883, September, 2006.【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

034 2006 Shaw-Ruey Lyu, Jeh-En Tzeng, Chia-Yuan Chang, Ai-Ru Jian, and De-Shin Liu,“Mechanical Strength of Mediopatellar Plica - the Influence of Its Fiber Content,” Clinical Biomechanics, Vol. 21,Issue 8, PP. 860-863, October, 2006. 【SCI ,EI】【NSC-93-2213-E-194-006】

035 2006 D. S. Liu, M. K. Shih, S. M. Liu, Tony Huang, Y. C. Chao, and C. C.Yu, “Experimental Aided Performance Evaluation Methods for Wafer Probe Test”, Experimental Techniques, Vol. 30, Issue 5, PP. 23-27,September/October, 2006. 【SCI ,EI 】【NSC94-2212-E-194-010 and NSC94-2212-E-194-013】

035 2007 D. S. Liu, M. K. Shih, and W. H. Huang,“Measurement and Analysis of Wafer Probe Testing Contact Resistance,” Microelectronics Reliability, Vol. 47, PP. 1086-1094 , 2007. 【SCI ,EI】

037 2007 C. Y. Ni, C. M. Chang, D. S. Liu, H. Y. Pan, and T. D. Yang,“Thermal Characterization of Thermal Interface Materials”, Experimental Techniques, Published article online: 4-May-2007,2007. 【SCI ,EI】

038 2007 D. S. Liu, and M. K. Shih,“An investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multi-probing Process,” IEEE Transactions on Components and Packaging Technologies, Submitted, June20, 2006, Revised,March04, Revised/re-submit, June 30, Accepted, July 21, 2007.【SCI ,EI】

039 2007 C. Y. Ni, C. M. Chang, D. S. Liu, H. Y. Pan, and T. D. Yang,“Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability”, Journal of Microelectronics and Electronic Packaging, Accepted, Oct. 05,2007. 【EI】

040 2007 T. N. Shiau, C. H. Kang, and D. S. Liu,“Interval optimization of rotor-bearing systems with dynamic behavior constraints using an interval-genetic algorithm,” Structural and Multidisciplinary Optimization, Revised, March. 11, 2rd Revised, July 15 , Accepted,Oct. 09,2007. 【SCI ,EI】

041 2007 Ching-I Chen, Ching-Yu Ni, H. Y. Pan, C. M. Chang, S. S. Yeh, and De-Shin Liu,“Practical evaluation for long-term stability of thermal interface Material,” Experimental Techniques, Submitted, April 02, accepted, Nov. 21, 2007. 【SCI ,EI】

042 2007 D. S. Liu, S. S. Yeh ,C. T. Kao, H. C. Shen, G. S. Shen, and H. H. Liu,“Optimization of bonding force, sinking value and potting gap size in COF inner lead bonding process,” IEEE Transactions on Advanced Packaging, Submitted, February 14, Reviced Nov. 05,2007. 【SCI ,EI】

001 2000 鄭友仁，林呈彰，劉德騏， “高速滾動軸承潤滑噴嘴裝置,”美國專利第6,158,898 號（核準日期：12/12/2000）。

002 2001 鄭友仁，林呈彰，劉德騏， “高速滾動軸承潤滑噴嘴裝置,” 中華民國新型專利第151678 號（核準日期：05/09/2001）, 日本專利申請中, 德國專利申請中。

003 2002 劉德騏， “主軸結構熱傳分析軟體與技術,” 專利技術移轉，臺灣麗偉電腦機械股份有限公司，2002.

004 2007 劉德騏， “可調整潰縮能量之方向機柱,” 專利申請中，申請案號96103203.

005 2007 劉德騏， “內藏式漸增潰縮能量之方向機柱,” 專利申請中，申請案號96103888.