NO

SCI Journal paper

SCI/SSCI Rank

N / M

1

D. S. Liu, P. C. Wen, Z. W. Zhuang, C. L. Chung, B. H. Chen, P. I. Chang, P. C. Huang*, “Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation,” Materials Today Communications, vol. 38, pp. 108369, Mar. 2024. (SCI Journal, Impact Factor =3.8, Materials Science, Multidisciplinary)

178/424

2

Y. W. Tsang, H. J. Fu, P. C. Huang, B.-N. Yadav, and D. S. Liu*, “Injection Moulding Process Parameter and Strain Rate Dependence Mechanical Properties Measurement and Theoretical Estimation of EVA Polymer Foam,” Journal of Mechanics, Vol. 40, pp. 2-10, Jan. 2024. (SCI Journal, Impact Factor =1.7, Engineering, Mechanical Engineering)

337/601

3

C. C. Lee*, C. P. Chang, and P. C. Huang, “Development and Demonstration on Process-oriented Warpage Simulation Methodology of Fan-out Panel-level Package in Multilevel Integration,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 13, No. 12, pp. 2016-2023, Dec. 2023. (SCI Journal, Impact Factor =2.2, Engineering, Industrial and Manufacturing Engineering)

109/338

4

D. S. Liu, P. C. Wen, Z. W. Zhuang, Y. C. Chao, and P. C. Huang*, “Temperature-Dependence Mechanical Characteristics Investigation of Cu Wire and Corresponding High Strain Rate Plasticity Behaviors Enabled by Johnson-Cook Constitutive Model,” Journal of Mechanics, Vol. 39, pp. 334-343, Aug. 2023. (SCI Journal, Impact Factor =1.7, Engineering, Mechanical Engineering)

337/601

5

S. H. Wang, W. Hsu*, Y. Y. Liou, P. C. Huang, and C. C. Lee*, “Layout Dependence Stress Investigation in Through Glass Via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach,” Micromachines, Vol. 14, No. 8, 1506 (page 15), Aug. 2023. (SCI Journal, Impact Factor =3.523, Engineering, Mechanical Engineering)

159/601

6

C. C. Lee*, P. C. Huang, and T. P. Hsiang, “Interactive Lattice and Process-Stress Responses in the Sub-7 nm Germanium-based Three-Dimensional Transistor Architecture of FinFET and Nanowire GAAFET,” IEEE Transactions on Electron Devices, Vol. 69, No. 12, pp. 6552-6560, Dec. 2022. (SCI Journal, Impact Factor =3.221, Engineering, Electrical & Electronic)

112/276

7

S. H. Wang, W. Hsu*, Y. Y. Liou, P. C. Huang, and C. C. Lee*, “Reliability Assessment of Thermocompressed Epoxy Molding Compound Through Glass Via Interposer Architecture by the Submodeling Simulation Approach,” Materials, Vol. 15, No. 20, Article 7357, Oct. 2022. (SCI Journal, Impact Factor =3.748, Physics, Applied)

56/161

8

C. C. Lee*, Y. Y. Liou, C. P. Chang, P. C. Huang, C. Y. Huang, K. C. Chen, and Y. J. Lin, “Estimated Approach Development and Experimental Validation of Residual Stress-Induced Warpage Under the SiN_x PECVD Coating Process,” Surface and Coatings Technology, Vol. 434, Article 128225, Mar. 2022. (SCI Journal, Impact Factor =4.865, Materials Science, Coatings & Films)

5/20

9

P. C. Huang, Y. M. Lin, H. N. Liu, and C. C. Lee*, “Process-Induced Warpage and Stress Estimation of Through Glass Via Embedded Interposer Carrier with Ring-Type Framework,” Microelectronics Reliability, Vol. 129, Article 114476, Feb. 2022. (SCI Journal, Impact Factor =2.662, Engineering, Electrical & Electronic)

141/276

10

P. C. Huang, and C. C. Lee, “Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique,” Materials, Vol. 14, No. 18, 5226 (page 16), Sep. 2021. (SCI Journal, Impact Factor =3.748, Physics, Applied)

56/161

11

N. Anand, K. C. Chang, P. C. Huang, A. C. Yeh, C. W. Tsai, C. C. Lee, M. T. Lee, and Y. B. Chen*, “An Effective and Efficient Model for Temperature and Molding Appearance Analyses for Selective Laser Melting Process,” Journal of Materials Processing Technology, Vol. 294, Article 117109, Aug. 2021. (SCI Journal, Impact Factor =6.162, Engineering, Manufacturing)

13/51

12

T. H. Hsu, P. C. Huang, M. Y. Lee, K. C. Chang, C. C. Lee*, M. Y. Li, C. P. Chen, K. K. Jen, and A. C. Yeh, “Effect of Processing Parameters on The Fractions of Martensite in 17-4PH Stainless Steel Fabricated by Selective Laser Melting,” Journal of Alloys and Compounds, Vol. 859, Article 157758, Apr. 2021. (SCI Journal, Impact Factor =6.371, Metallurgy, Metallurgical Engineering)

5/79

13

C. C. Lee, C. P. Hsieh, P. C. Huang, and M. H. Liao, “Performance Characteristics of Strained Ge p-FinFETs Under the Integration of Lattice and Self-heating Stress Enabled by Process-Oriented Finite Element Simulation,” Applied Physics Express, Vol. 14, No. 3, Article 035504, Feb. 2021. (SCI Journal, Impact Factor =2.819, Physics, Applied)

78/161

14

C. C. Lee, Y. F. Lin, Y. Y. Liou, P. C. Huang, C. C. Liang, S. T. Yeh, and H. Y. Chen, “Simulated and Experimental Demonstrations of Interfacial Adhesive Strength for Released Layer Utilized in Flexible Electronics,” Thin Solid Films, Vol. 706, Article 138022, Jul. 2020. (SCI Journal, Impact Factor =2.358, Physics, Applied)

95/161

15

C. C. Lee, P. C. Huang, Y. C. Lin, and B. T. Chian, “Demonstration of an Equivalent Material Approach for the Strain-Induced Reliability Estimation of Stacked-Chip Packaging,” IEEE Transactions on Device and Materials Reliability, Vol. 20, No. 2, pp. 475-482, Jun. 2020. (SCI Journal, Impact Factor =1.886, Engineering, Electrical & Electronic)

188/276

16

C. C. Lee, P. C. Huang, and Y. C. Lin, “Analytical Model Developed for Precise Stress Estimation of Device Channel within Advanced Planar MOSFET Architectures,” IEEE Transactions on Electron Devices, Vol. 67, No. 4, pp. 1498-1505, Apr. 2020. (SCI Journal, Impact Factor =3.221, Engineering, Electrical & Electronic)

112/276

17

C. C. Lee, R. C. Shih, P. C. Huang, and S. F. Tseng, “Adhesion Enhancement of Conductive Graphene/PI substrates Through a Vacuum Plasma System,” Surface and Coatings Technology, Vol. 388, Article 125601, Apr. 2020. (SCI Journal, Impact Factor =4.865, Materials Science, Coatings & Films)

5/20

18

C. C. Lee, and P. C. Huang, “Comprehensive Stress Effect of Thin Coatings and Silicon-Carbon Lattice Mismatch on Nano-scaled Transistors with Protruding Poly Gate,” Journal of Nanoscience and Nanotechnology, Vol. 20, No. 2, pp. 760-768, Feb. 2020. (SCI Journal, Impact Factor =1.134, Physics, Condensed Matter)

55/69

19

C. C. Lee, and P. C. Huang, “Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications,” Computer Modeling in Engineering & Sciences, Vol. 120, No. 2, pp. 239-260, 2019. (SCI Journal, Impact Factor =2.027, Mathematics, Interdisciplinary Applications)

53/108

20

C. C. Lee, P. C. Huang, J. Y. He, and J. C. Chuang, “Laminated Process Effect of High-Density Redistributed Trace Lines on the Risk Estimation of Induced-Stress Failure for 3D-IC Embedded Interposer,” Microsystem Technologies, Vol. 25, No. 5, pp. 2021-2028, May 2019. (SCI Journal, Impact Factor =0.708, Engineering, Electrical & Electronic)

177/276

21

C. C. Lee, and P. C. Huang, “Layout Study of Strained Ge-Based PMOSFETs Integrated with S/D GeSn Alloy and CESL by Using Process-Oriented Stress Simulations,” IEEE Transactions on Electron Devices, Vol. 65, No. 11, pp. 4975-4981, Nov. 2018. (SCI Journal, Impact Factor =3.221, Engineering, Electrical & Electronic)

112/276

22

C. C. Lee, and P. C. Huang, “Mixed Mode Interfacial Crack Energy Estimation of Glass Interposer and SiNx Coatings by Using Fracture Mechanics Based Computer Methods and Experimental Validations,” Theoretical and Applied Fracture Mechanics, Vol. 96, pp. 790-794, Aug. 2018. (SCI Journal, Impact Factor =4.374, Mechanics)

28/138

23

C. C. Lee, and P. C. Huang, “Material Lattice Orientation Effect of Local Si_1-xGe_x Stressors on the Width Dependence of High-k Metal Gate PMOSFETs,” Current Applied Physics, Vol. 18, pp. S2-S7, Aug. 2018. (SCI Journal, Impact Factor =2.856, Physics, Applied)

75/161

24

C. C. Lee, and P. C. Huang, “Magnifying the Effective Intrinsic Stress of Surface Coating on the Performance of Nano-scaled Ge-based High-k/Metal Gate Device through Superficial Layout Designs,” Thin Solid Films, Vol. 660, pp. 725-729, Aug. 2018. (SCI Journal, Impact Factor =2.358, Physics, Applied)

95/161

25

C. C. Lee, and P. C. Huang, “The Development of Estimated Methodology for Interfacial Adhesion of Semiconductor Coatings Having an Enormous Mismatch Extent,” Applied Surface Science, Vol. 440, pp. 202-208, May 2018. (SCI Journal, Impact Factor =7.392, Materials Science, Coatings & Films)

1/20

26

C. C. Lee, P. C. Huang, and J. Y. He “Layout Designs of Surface Barrier Coatings for Boosting the Capability of Oxygen/Vapor Obstruction Utilized in Flexible Electronics,” Applied Surface Science, Vol. 436, pp. 183-188, Apr. 2018. (SCI Journal, Impact Factor =7.392, Materials Science, Coatings & Films)

1/20

27

C. C. Lee, and P. C. Huang, “Comprehensive Effects of Strained Ge_1-xSn_x and Device Layout Arrangement on a Nano-scale Ge-based PMOSFET with a Short Channel,” Materials Science in Semiconductor Processing, Vol. 70, pp. 145-150, Nov. 2017. (SCI Journal, Impact Factor =4.644, Engineering, Electrical & Electronic)

75/276

28

C. C. Lee, W. C. Wang, P. C. Huang, Y. Y. Liou, and H. N. Liu, “Improvements of Stress Migration in Nano-Scaled Copper Interconnects,” Science of Advanced Materials, Vol. 9, No. 1, pp. 11-16, Jan. 2017. (SCI Journal, Impact Factor =1.067, Material Science, Multidisciplinary)

306/345

29

C. C. Lee, and P. C. Huang, “Stress-induced Failure Predictions of Flexible Electronics with Nano-Scaled Thin-Films,” Science of Advanced Materials, Vol. 9, No. 1, pp. 6-10, Jan. 2017. (SCI Journal, Impact Factor =1.067, Material Science, Multidisciplinary)

306/345

30

C. P. Hsieh, M. H. Liao, C. C. Lee, T. C. Cheng, C. P. Wang, P. C. Huang, and S. W. Cheng “Shallow Trench Isolation Geometric Influence of a Recessed Surface on Array-type Arrangements of Nano-scaled Devices Strained by Contact Etch Stop Liner and Ge-based Stressors,” Thin Solid Films, Vol. 618, Part A, pp. 172-177, Nov. 2016. (SCI Journal, Impact Factor =2.358, Physics, Applied)

95/161

31

C. C. Lee, P. C. Huang, and K. S. Wang, “Flexural Capability of Patterned Transparent Conductive Substrate by Performing Electrical Measurements and Stress Simulations,” Materials, Vol. 9, No. 10, pp. 850, Oct. 2016. (SCI Journal, Impact Factor =3.748, Physics, Applied)

56/161

32

C. C. Lee, C. C. Tsai, J. C. Chuang, P. C. Huang, S. W. Cheng, and Y. Y. Liou, “Adhesion Investigation of Stacked Coatings in Organic Light-Emitting Diode Display Architecture,” Surface and Coatings Technology, Vol. 303, pp. 226-231, Oct. 2016. (SCI Journal, Impact Factor =4.865, Materials Science, Coatings & Films)

5/20

33

J. S. Hsu, C. C. Lee, B. J. Wen, P. C. Huang, and C. K. Xie, “Experimental and Simulated Investigations of Thin Polymer Substrates with an Indium Tin Oxide Coating under Fatigue Bending Loadings,” Materials, Vol. 9, No. 9, pp. 720, Aug. 2016. (SCI Journal, Impact Factor =3.748, Physics, Applied)

56/161

34

C. C. Lee, C. P. Hsieh, P. C. Huang, S. W. Cheng, and M. H. Liao, “Ge_1-xSi_x on Ge-Based N-Type Metal-Oxide Semiconductor Field-Effect Transistors by Device Simulation Combined with High-Order Stress–Piezoresistive Relationships,” Thin Solid Films, Vol. 602, pp. 78-83, Mar. 2016. (SCI Journal, Impact Factor =2.358, Physics, Applied)

95/161

35

B. J. Wen, C. C. Lee, J. S. Hsu, P. C. Huang, and C. H. Tsai, “Investigation of Optical and Flexible Characteristics for Organic-Based Cholesteric Liquid Crystal Display by Utilizing Bending and Torsion Loadings,” IEEE/OSA Journal of Display Technology, Vol. 11, No. 9, pp. 682-688, Sep. 2015. (SCI Journal, Impact Factor =2.417 at 2015)

N/A

36

C. C. Lee*, T. L. Tzeng, and P. C. Huang, “Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging,” Materials, Vol. 8, No. 8, pp. 5121-5137, Aug. 2015. (SCI Journal, Impact Factor =3.748, Physics, Applied)

56/161

  NO

Conference Proceeding paper

1

Y. C. Lin, P. C. Huang, and C. C. Lee*, “Mechanical-Based Analytical Derivation and Verification for the Performance Enhancement of Strain-Induced Advanced Semiconductor Device,” Proceedings of the 44^th Conference on Theoretical and Applied Mechanics, Yilan, Taiwan, Nov. 26-27, 2020.

2

C. C. Lee*, and P. C. Huang, “Effectiveness of Embedded poly Si Wall on 7 nm FinFET Architecture with Strain Relaxed Buffer Design,” TACT2019 International Thin Films Conference, Taipei, Taiwan, Nov. 17-20, 2019.

3

C. C. Lee*, P. C. Huang, and Y. C. Lin, “Comprehensive Stress Effects Induced by Through Silicon Via Integrated with Local S/D Stressor on Performances of Nano-Scaled Devices in Silicon Interposer Architecture,” the 18^th International Symposium on Microelectronics and Packaging jointed with the 21^st International Conference on Electronic Materials and Packaging (ISMP-EMAP 2019), Busan, Korea, Nov. 13-15, 2019.

4

C. C. Lee*, P. C. Huang, and C. W. Wang, “Performance Variation of Nano-Scaled Devices in 3D-IC Packaging Architecture Induced by TSV Residual Stress,” ASME International Mechanical Engineering Congress and Exposition (IMECE), Salt Lake City, Utah, USA, Nov. 11-14, 2019.

5

C. C. Lee*, P. C. Huang, C. W. Wang, and Oscar Chuang, “Stress Evaluation of Flexible Displays with Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA, USA, Oct. 7-9, 2019.

6

C. C. Lee*, P. C. Huang, and C. P. Hsieh, “Interfacial Fracture Investigation of Patterned Active Matrix OLED Driven by Amorphous-Si TFTs under Film-Type Packaging Technology,” 3^rd International Conference on Applied Surface Science (ICASS), Pisa, Italy, Jun. 17-20, 2019.

7

C. C. Lee*, P. C. Huang, and Y. H. Chang, “Substrate Pre-heating Effect on the Residual Stress Evaluation of WC-based High Entropy Superalloy During SLM Additive Manufacturing Process,” 3^rd International Conference on Applied Surface Science (ICASS), Pisa, Italy, Jun. 17-20, 2019.

8

C. C. Lee*, Y. Y. Liou, P. C. Huang, F. Hsu, P. B. Lin, C. T. Ko, and Y. H. Chen, “Comprehensive Investigation on Warpage Management of FOPLP with Multi Embedded Ring Designs,” The 69^th IEEE Electronic Components Technology Conference (ECTC 2019), Las Vegas, NV, USA, May 28-31, 2019

9

C. C. Lee*, P. C. Huang, and C. W. Wang, “Layout Effect of Stress Coatings Integrated with Silicon-Carbon Semiconductor Alloy on Nano-scaled Transistors with Protruding Gate,” Proceedings of the 35^th National Conference on Mechanical Engineering (CSME), Chiayi, Taiwan, Nov. 30-Dec. 1, 2018.

10

C. C. Lee*, Y. Y. Liou, and P. C. Huang, “Comprehensive Stress Impacts on Flexible Displays under the Process-Induced Thermal and Subsequent External Bending Loads,” the Sixth Asian Conference on Mechanics of Functional Materials and Structures (ACMFMS 2018), Tainan, Taiwan. Oct. 26-29, 2018.

11

C. C. Lee*, J. Y. He, and P. C. Huang, “Elastic Modulus Extraction of Single-Crystal Copper by Using Spring-based Finite Element Method,” the 2^nd International Conference on Mechanics (ICM 2018), Yilan, Taiwan, Oct. 15-18, 2018. (Invited Lecture)

12

C. C. Lee*, and P. C. Huang, “Layout Effect of Polysilicon Wall Embedded in Shallow Trench Isolation Region on the Performance of High-k/Metal Gate PMOSFETs,” 16^th International Nanotech Symposium & Exhibition (NANO KOREA 2018), Seoul, Jul. 10-13, 2018.

13

C. C. Lee*, Y. Y. Liou, and P. C. Huang, “Structural Designs of Gas Barriers For Diminishing Stress-Induced Failure Occurred in Flexible Electronics,” Proceedings of the 41^th Conference on Theoretical and Applied Mechanics, Tainan, Taiwan, Nov. 24-25, 2017.

14

C. C. Lee*, J. Y. He, and P. C. Huang, “Redistributed Geometrical Effect of Cu-Filled Stacked Vias on the Thermal-Induced Stress and Warpage of 3D-ICs Embedded Interposer,” International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017), Hualien, Taiwan, Oct. 27-31, 2017.

15

C. C. Lee*, and P. C. Huang, “Layout Design Effect of Transverse Dummy Polys on Stress-Induced Performance of Ge-Based High-k/Metal Gate NMOSFETs,” TACT 2017 International Thin Films Conference, Hualien, Taiwan, Oct. 15-18, 2017.

16

C. C. Lee*, and P. C. Huang, “Resultant Impacts of Stress Gradient CESL and Embedded S/D SiC Stressors on Nano-Scaled Si-Based Strained NMOSFETs,” TACT 2017 International Thin Films Conference, Hualien, Taiwan, Oct. 15-18, 2017.

17

C. C. Lee*, and P. C. Huang, “Lattice Orientation Effect of Local Stressors on the Width Dependence Performance of High-k Metal Gate PMOSFETs,” 15^th International Nanotech Symposium & Exhibition (NANO KOREA 2017), Seoul, Jul. 12-14, 2017.

18

C. C. Lee*, P. C. Huang, and C. W. Wang, “The Development of Estimated Methodology for Interfacial Adhesion of Semiconductor Coatings Having an Enormous Mismatch Extent,” 2^nd International Conference on Applied Surface Science (ICASS), Dalian, China, Jun. 12-15, 2017.

19

C. C. Lee*, J. Y. He, P. C. Huang, and C. W. Wang, “Interactive Field Effect of Atomic Bonding Force on Nano-Scale Metal Elastic Modulus By Using Atomistic-Continuum Simulation,” 2^nd International Conference on Applied Surface Science (ICASS), Dalian, China, Jun. 12-15, 2017.

20

C. C. Lee*, J. Y. He, P. C. Huang, and H. C. Liu, “Experimental Measurements and Simulated Estimations for the Interfacial Adhesion Between Glass Interposer and SiNx Coatings,” 2^nd International Conference on Applied Surface Science (ICASS), Dalian, China, Jun. 12-15, 2017.

21

C. C. Lee*, J. Y. He, P. C. Huang, and H. C. Liu, “Layout Designs of Surface Barrier Coatings for Boosting the Capability of Oxygen/Vapour Obstruction Utilized in Flexible Electronics,” 2^nd International Conference on Applied Surface Science (ICASS), Dalian, China, Jun. 12-15, 2017.

22

C. H. Chen, P. C. Huang, and C. C. Lee*, “Residual Stress Effect of Through silicon Vias on the Operated Performance of Nano-Scaled Strained-Si Devices,” Proceedings of the 40^th Conference on Theoretical and Applied Mechanics, Hsinchu, Taiwan, Nov. 25-26, 2016.

23

C. C. Lee*, and P. C. Huang, “Investigation of Chip-Interposer Interaction by Loading the Residual Stress of Copper-Filled Through Silicon Via,” 2016 International Electron Devices and Materials Symposium (IEDMS), Taipei, Taiwan, Nov. 24-25, 2016.

24

J. S. Hsu, C. C. Lee*, B. J. Wen, P. C. Huang, and C. K. Xie, “Experimental and Simulated Investigations of a Thin Polymer Substrate with ITO Coatings under Fatigue Bending Loadings,” International Multi-Conference on Engineering and Technology Innovation 2016 (IMETI2016), Taichung, Taiwan, Oct. 28-Nov. 1, 2016.

25

C. C. Lee*, C. H. Chen, and P. C. Huang, “Residual Stress Investigation of TSVs on MOSFETs by Using Submodeling Finite Element Technique,” IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016 Joint Conference), Taipei, Taiwan, Oct. 26-28, 2016.

26

C. C. Lee*, T. C. Cheng, and P. C. Huang, “Comprehensive Effects of Strained Ge1-xSnx and Device Layout Arrangement on a Nano-Scaled Ge-based PMOSFET with a Short Channel,” International SiGe Technology and Device Meeting (ISTDM 2016), pp. 65-66, Nagoya, Japan, Jun. 7-11, 2016.

27

C. C. Lee*, P. C. Huang, Y. T. Kuo, D. Y. Li, and C. H. Liu, “Interaction Influence of S/D GeSi Lattice Mismatch and Stress Gradient of CESL on Nano-Scaled Strained NMOSFETs,” 7^th International Symposium on Control of Semiconductor Interfaces (ISCSI-VII), pp. 43-44, Nagoya, Japan, Jun. 7-11, 2016.

28

C. C. Lee*, P. C. Huang, and B. T. Chian, “Development and Demonstration of Equivalent Material Characteristics for Microbump Arrays Utilized in Failure Estimation of Chip-on-Chip Packaging,” 2016 Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems (ITHERM 2016), Las Vegas, NV, USA, May 31-Jun. 3, 2016.

29

C. C. Lee*, S. W. Cheng, and P. C. Huang, “STI Geometrical Influence of Recessed Surface on Array-Type Arrangements of Nano-Scaled Devices Strained by CESL and Ge-based Stressors,” TACT 2015 International Thin Films Conference, Tainan, Taiwan, Nov.15-18, 2015. 

30

C. C. Lee*, T. L. Tzeng, and P. C. Huang, “Development for Equivalent Material Properties of Microbump Utilized in Simulation of Chip Stacking Packaging,” International Multi-Conference on Engineering and Technology Innovation 2015 (IMETI2015), Kaohsiung, Taiwan, Oct. 30-Nov. 3, 2015.

31

C. C. Lee*, C. P. Hsieh, P. C. Huang, S. W. Cheng, and M. H. Liao, “A Performance Study of Ge_1-xSi_x on Ge-Based NMOSFETs by Using Device Simulation Combined with Higher Order Stress-Piezoresistive Relationships,” 9^th International Conference on Silicon Epitaxy and Heterostructures (ICSI-9), Montreal, Canada, May 17-22, 2015.

32

C. C. Lee*, T. L. Tzeng, and P. C. Huang, “Development of Simulation-Approach for 3D Chip Stacking with Fine-Pitch Array-Type Microbumps,” 2015 International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP-IAAC 2015), Kyoto, Japan, Apr. 14-17, 2015.

33

C. C. Lee*, and P. C. Huang, “Stress-induced Failure Predictions of Flexible Electronics with Nano-Scaled Thin-Films,” the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014), Jeju, Korea, Oct. 26-29, 2014.

34

C. C. Lee*, W. C. Wang, P. C. Huang, Y. Y. Liou, and H. N. Liu, “Improvements of Stress Migration in Nano-scaled Copper Interconnects,” the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014), Jeju, Korea, Oct. 26-29, 2014.

  NO

Patents

1

李昌駿; 黃北辰; 王韡蒨, “Multi-layer film structure,” I597816, Aug. 23, 2016.

2

李昌駿; 黃北辰; 謝佳坪; 王啟瑋, ”可撓式之光電元件的光電特性檢測方法,” I783223, Nov. 11, 2022.