1. J. N. Aoh, C. S. Wei, “On the Improvement of Calibration Coefficients for Hole-drilling Integral Method ： Part II—Experimental Validation of Calibration Coefficients”, Transactions of ASME, Journal of Engineering Materials and Technology, Vol.125, April 2003, pp.107-115 , (SCI) (NSC-89-2212-E-194-034) (Impact factor：0.843).

2. J. N. Aoh, C. L. Chuang, “Thermosonic Bonding of Gold Wire onto Copper pad with Titanium Thin Film Deposition”, Journal of Electronic Materials, Vol.33, No.4, 2004, pp.290-299 (SCI) (NSC91-2212-E-194-039) (Impact factor：1.382).

3. J. N. Aoh, C. L. Chuang, “Development of a Thermosonic Wire Bonding Process for Gold Wire Bonding to Copper Pads Using Argon Shielding”, Journal of Electronic Materials, Vol.33, No.4, 2004, pp.300-311, (SCI) ( NSC90-22120-E-194-031) (Impact factor：1.382).

4. C. L. Chuang, J. N. Aoh, R. F. Din, “Oxidation of Copper Pads and its Influence on the Quality of Au/Cu Bonds during Thermosonic Wire Bonding Process”, Microelectronics Reliability, Vol.46, 2006, pp. 449-458 (SCI)（NSC92-2212-E-194-005） (Impact factor：1.01).

5. C. L. Chuang, J. N. Aoh, “Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the bond pads of Chips with Copper Interconnects”, Journal of Electronic Materials, Vol.35, No.4, 2006, pp. 1693-1700 (SCI)（NSC93-2212-E-040-001）(Impact factor：1.32).

6. C. L. Chuang, J. N. Aoh, “Gold Stud Bump Flip-Chip Bored onto Copper Electrfes with Titanium and Silver Layers”, Journal of Electronic Materials, Vol.37, No.11, 2008, pp.1742-1750 (SCI)(NSC-93-2212-E-040-001) (Impact factor：1.32).

國際學術會議論文：

1. C. L. Chuang and J. N. Aoh, “Process Development of Au Wire Thermosonic Bonding to Cu Pad by Ti Passivation Layer”, TPCA Forum 2003 , Oct., 2003, Taipei, Taiwan, pp.206-213

2. J. N. Aoh, C.W. Lin and Z. H. Lin, “Numerical and Physical Simulation on Upset Forging Process of Ti-6Al-4V Alloy,” The 4th International Conference on Physical and Numerical Simulation of Material Processing (ICPNS), May 2004, Shanghai, China.

3. J. N. Aoh, H. M. Chen and Y. S. Chen, “Validation of residual stress measurement combining hole-drilling strain gauge technique and Moire interferometry,” ICEM12-12th International Conference on Experimental Mechanics, 29 August – 2 September 2004, Bari, Italy, in “Advances in Experimental Mechanics”, C. Pappalettere ed., McGraw-Hill, p. 644, 2004.

4. S. J. Liao, and J. N. Aoh, “Numerical Analysis and Experimental Validation on Laser Cladding Process with Pre-placed Powder Layer,” 8
th International Seminar - Numerical Analysis of Weldability, Sept. 25-27, 2006, Graz, Austria, in “Mathematical Modelling of Weld Phenomena 7”, Eds. H. Cerjak, H.K.D.H. Bhadeshia, E. Kozeschnik, Verlag der Technischen Universitat Graz, Graz, 2006.

5. J. N. Aoh, Y. C. Wu, J. Y. Lee, “In-Plane Residual Stress Measurement Combining Hole Drilling Method and Moire Interferometry”, ICEME13, The 13th International Conference on Experimental Mechanics, July 1-6, 2007, Alexandroupolis, Greece, pp.907-908.

6. J. N. Aoh, Y. C. Wu, J. Y. Lin, “Direct Nanoimprinting of Gold Film for Fabricating Metallic Gratings”, NNT08, The 7th International Conference on Nanoimprint and Nanoimprint Technology, Oct.13-15, 2008, Kyoto, Japan.

7. C. L. Chuang, J. N. Aoh, Q. A. Liao, G. S. Huang,” Feasibility and bonding Strength & Gold Stub Bumps Thermosonic Flip-Chip bonding onto Flwx Substrates with Non-Conductive Pastes”, the 3rd IMPACT and 10th EMAP Joint Conference, Oct.22-24, 2008, Taipei, Taiwan, R.O.C.

國內研討會論文：

1. C. L. Chuang and J. N. Aoh,” Thermosonic Bonding of Au wire onto Cu pad with Ag Bonding Layer”, in Proceedings of the International Microelectronics And Packaging Society, May 2004, Kaohsiung, Taiwan.

2. J. N. Aoh and C. L. Chuang, “Development of Thermosonic Wire Bonding Process for IC Chips with Copper Interconnects,” 8th R.O.C. Symposium On Fracture Science, March 2004, Kenting, Taiwan, The Chinese Soc. of Materials Science.

3. 敖仲寧,游嘉寶,“高入熱量潛弧銲接參數與銲道錳鉬含量對顯微結構與韌性之影響,” in Proceedings of the Annual Conference on Welding Technology, Welding Association of the R.O.C., Oct. 2004, Taipei, Taiwan, (銲接協會最佳學術論文獎).

4. 敖仲寧,游嘉寶,“高入熱量潛弧銲接之銲材合金元素對微結構與衝擊韌性之影響”, in Proceedings of the 2004 Annual Meeting of the Chinese Society of Material Science, Nov. 2004, Hsin-chu, Taiwan.

5. 敖仲寧,陳揚世, “鑽孔形狀對盲孔法殘留應力分析之校正係數的影響,” in Proceedings of the 21st National Conference of the Chinese Society of Mechanical Engineers, Dec. 2004, Kaohsiung, Taiwan.

6. 敖仲寧,徐星杓, “鋼胚熱軋製程中的裁寬側壓過程分析,” in Proceedings of the 21st National Conference of the Chinese Society of Mechanical Engineers, Dec. 2004, Kaohsiung, Taiwan

7. J. N. Aoh and J.C. Yen, “Laser surfacing alloying of iron-base layer on A390 Al-Si alloy using Nd-YAG laser,” in Proceedings of the 2004 Annual Meeting of the Chinese Society of Material Science, Nov. 2004 , Hsin-chu, Taiwan.

8. 敖仲寧,黃正一, “結合雲紋干涉術與盲孔鑽孔法量測殘留應力,” in Proceedings of the 22th National Conference of the Chinese Society of Mechanical Engineers , Dec. 2005, Jhongli, Taiwan.

9. 敖仲寧,許俊傑, “Develop of a stud Bump Bonding Process for Bumps Bounded onto Copper Pads,” in Proceedings of the 22nd National Conference of the Chinese Society of Mechanical Engineers, Dec. 2005, Jhongli, Taiwan.

10. 敖仲寧,官正邦, “運用有限元素法分析鋼胚熱軋之Sizing Press側壓裁寬製程,” 第十屆 ABAQUS Taiwan Users’ Conference, Nov. 2005, Taipei, Taiwan.

11. 敖仲寧,張維麟,林鼎崴, “6061鋁合金及其顆粒強化銲道之摩擦攪拌銲接研究,” in Proceedings of the Annual Conference on Welding Technology, Welding Association of the R.O.C., Oct. 2005, Changhua, Taiwan, (銲接協會最佳學術論文獎).

12. 敖仲寧,張維麟,林鼎崴, “6061鋁合金薄板的摩擦攪拌銲接與製程動態負荷分析,” in Proceedings of the 2005 National Conference of the Chinese Society of Mechanical Engineers, 2005, Jhongli, Taiwan.

13. 敖仲寧,張維麟,林鼎崴, “6061鋁合金厚板的摩擦攪拌銲接材料流動行為研究,” in Proceedings of the 2005 Annual Meeting of the Chinese Society of Material Science, 2005, Taipei, Taiwan.

14. C. L. Chuang, J. N. Aoh and J. J. Hsu, “Development of a Gold Stud Bump Bonding process for Bumps Bonded onto Copper Pads”, in Proceedings of the 22 nd Conference on Mechanical Engineering, Nov. 2005 , Chung-Li, Taiwan.

15. C. L. Chuang, J. N. Aoh and J. J. Hsu, “Study on Gold Stud Bump Bonding Process for Wafer with Copper Pads”, in Proceedings of the 2005 Conference on Welding Engineering, Oct. 2005, Chang-Hua, Taiwan, pp.61-68.

16. 敖仲寧,林鼎崴,徐千富, “6061-T鋁合金摩擦攪拌銲接之流動性質與動態負荷研究,” in Proceedings of the Annual Conference on Welding Technology, Welding Association of the R.O.C., Oct. 2006, Kaohsiung, Taiwan.

17. 敖仲寧, 林哲宇, 周仲鯨, 李文浚, “奈米柵狀模仁之直接金屬壓印成型性研究,” in Proceedings of the 2008 National Conference of the Chinese Society of Mechanical Engineers, Nov, 2008, Changhua, Taiwan.

18. 敖仲寧, 林哲宇, 周仲鯨, 李文浚, “晶粒細化金薄膜之製備與直接壓印成型性研究,” in Proceedings of the 2008 Annual Meeting of the Chinese Society of Material Science, Nov, 2008, Taipei, Taiwan.

19. 敖仲寧,黃金發,程群傑,童山,黃玉寶, “鋁基複合材料摩擦攪拌銲接銲道特徵分析研究” in Proceedings of the 2008 Annual Meeting of the Chinese Society of Material Science, Nov, 2008, Taipei, Taiwan.

20. 敖仲寧,黃金發,程群傑,童山,黃玉寶, “顆粒強化鋁基複合材料之摩擦攪拌銲接動態負荷與機械性質探討” in Proceedings of the 2008 National Conference of the Chinese Society of Mechanical Engineers, Nov, 2008, Changhua, Taiwan

21. 莊正利, 陳韋豪,敖仲寧,李巡天,“矽晶片以非導電膠與熱音波覆晶製程接著於軟性基板之可靠度研究,” in Proceedings of the 2008 National Conference of the Chinese Society of Mechanical Engineers, Nov, 2008, Changhua, Taiwan.

22. 莊正利, 陳韋豪,敖仲寧,黃國興,陳輝達,“銅晶片以熱音波覆晶製程與非導電膠接合於軟性基板 之可靠度研究,” in Proceedings of the 2008 Annual Meeting of the Chinese Society of Material Science, Nov, 2008, Taipei, Taiwan.

23. 敖仲寧,陳明傑,呂秉倫,“結合雲紋干涉術與鑽孔法之雙軸平面應力狀態殘留應力分析” in Proceedings of the 2008 National Conference of the Chinese Society of Mechanical Engineers, Nov, 2008, Changhua, Taiwan.

24. 敖仲寧, 陳明傑,呂秉倫,“結合雲紋干涉術與鑽孔法之雙軸平面應力狀態殘留應力分析” in Proceedings of the 2008 National Conference of Theoretical and Applied Mechanics, Dec, 2008, Chiayi, Taiwan.

25. 敖仲寧,何昆霖,陳明發, “粗軋區Sizing Press裁寬製程鋼胚不對稱之有限元素分析,” in Proceedings of the 2008 ABAQUS Taiwan Users＇Conference, Nov., 2008, Taipei, Taiwan.

26. 敖仲寧,何昆霖,陳明發, “粗軋區裁寬製程鋼胚不對稱之有限元素分析,” in Proceedings of the 2008 National Conference of Theoretical and Applied Mechanics, Dec, 2008, Chiayi, Taiwan.

1 與中鋼公司合作發展熱軋成型數值模擬工具與sizing press 分析以及熱軋顯微組織演化分析。完成飛具薄板結構之試製及厚板鋁合金模具之試製。

2.與漢翔航空工業有限公司合作研究 ”先進複材模具之銲接特性研究”發展摩擦攪拌銲接技術完成飛具薄板結構之試製及厚板鋁合金模具之試製。